Tempe-based Amkor Technology Inc. recently announced its shipping of 700 million RF and front-end advanced system-in-package (SiP) modules that deliver high performance at low costs to mobile devices.
Made up of semiconductor components, a SiP module is a single integrated circuit package with capabilities in interconnecting technology, such as wire-bonding, copper pillars through silicon vias and more.
Amkor has been providing outsourced semiconductor packaging and test services since 1968 and works with over 250 companies around the world. The company's operational base covers over 8 million square feet, and the company has manufacturing regions worldwide, including Asia, Europe and the U.S.
The wafer-based SiPs from Amkor are capable of quick cycle-time, which increase the cost-effectiveness, and its silicon wafer integrated fan-out (SWIFT) and silicon-less integrated module (SLIM) versions are slimmer and denser than laminate-based models and cost less.
"Our broad technology portfolio and engineering talent make Amkor an excellent choice for customers seeking high-performance, miniaturized solutions," Amkor CEO and President Steve Kelley said.