Driven by the increase in global demand for sensors for the smartphone and automotive markets, Amkor Technology Inc. is adding a new MEMS and sensor packaging line at its facility in Shanghai.
This new, state-of-the-art line will build on the expertise developed at the company's MEMS packaging line in the Philippines, which has produced more than 2.1 billion MEMS and sensors since 2011.
“Because the package influences device performance, MEMS and sensor development requires close collaboration between device technologists and packaging engineers,” John Donaghey, Amkor’s corporate vice president, mainstream products business unit, said. “Our Shanghai expansion allows us to better serve customers in Greater China and internationally.”
The new line in Shanghai uses Amkor’s standard strip-based processes and leading-edge test protocols to speed up the time to market.
Amkor Technology is one of the world’s largest providers of semiconductor packaging and test services. Founded in 1968, the company is a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs.
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